Dupont – HIGH TECH https://www.hightechelettronica.com/en/ Elettronica PCB board e circuiti stampati Torino Tue, 29 Mar 2022 08:44:44 +0000 en-US hourly 1 https://wordpress.org/?v=5.7.1 Printed circuit AP9141R https://www.hightechelettronica.com/en/circuito-stampato/ap9141r/ Tue, 23 Nov 2021 16:02:07 +0000 https://www.hightechelettronica.com/circuito-stampato/ap9141r/ DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminate
featuring an adhesive-less, all-polyimide dielectric laye

Low loss all-polyimide dielectric for superior signal integrity
• Excellent bond strength affords high reliability
• High thermal resistance to facilitate processing
• Balanced and unbalanced constructions available
• Certified to IPC 4204/11
• UL 94 V-0, UL File E124294
• RoHS Compliant

]]> Printed circuit AP9121R https://www.hightechelettronica.com/en/circuito-stampato/ap9121r/ Tue, 23 Nov 2021 16:01:34 +0000 https://www.hightechelettronica.com/circuito-stampato/ap9121r/ DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminate
featuring an adhesive-less, all-polyimide dielectric laye

Low loss all-polyimide dielectric for superior signal integrity
• Excellent bond strength affords high reliability
• High thermal resistance to facilitate processing
• Balanced and unbalanced constructions available
• Certified to IPC 4204/11
• UL 94 V-0, UL File E124294
• RoHS Compliant

]]> Printed circuit AP9111R https://www.hightechelettronica.com/en/circuito-stampato/ap9111r/ Tue, 23 Nov 2021 16:01:07 +0000 https://www.hightechelettronica.com/circuito-stampato/ap9111r/ DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminate
featuring an adhesive-less, all-polyimide dielectric laye

Low loss all-polyimide dielectric for superior signal integrity
• Excellent bond strength affords high reliability
• High thermal resistance to facilitate processing
• Balanced and unbalanced constructions available
• Certified to IPC 4204/11
• UL 94 V-0, UL File E124294
• RoHS Compliant

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