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		<title>Printed circuit KB 6160</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6160/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:13:18 +0000</pubDate>
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					<description><![CDATA[KB-6160 （ANSI：FR-4）Fiberglass laminate 130℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6160 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>130℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
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		<title>Printed circuit KB 6160C</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6160c/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:12:39 +0000</pubDate>
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					<description><![CDATA[KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6165 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>150℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
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		<item>
		<title>Printed circuit KB 6165</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6165/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:12:00 +0000</pubDate>
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					<description><![CDATA[KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6165 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>150℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
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