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	<title>Industrial &#8211; HIGH TECH</title>
	<atom:link href="https://www.hightechelettronica.com/en/operating-fields/industrial/feed/" rel="self" type="application/rss+xml" />
	<link>https://www.hightechelettronica.com/en/</link>
	<description>Elettronica PCB board e circuiti stampati Torino</description>
	<lastBuildDate>Tue, 29 Mar 2022 08:53:55 +0000</lastBuildDate>
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	<item>
		<title>Printed circuit VT-481</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/vt-481/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:19:13 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/vt-481/</guid>

					<description><![CDATA[Mid-Tg FR4 &gt; Phenolic Cure System &amp; Lead Free Compatible &gt; Excellent Thermal Reliability &gt; Low Z-CTE &gt; CAF Resistance &gt; UV Blocking Application Computer, Communication Equipment, Instrumentation, TV, VCR, Electronic Game Machine, LCD, Automotive, etc.]]></description>
										<content:encoded><![CDATA[<p>Mid-Tg FR4<br />
&gt; Phenolic Cure System &amp; Lead Free Compatible<br />
&gt; Excellent Thermal Reliability<br />
&gt; Low Z-CTE<br />
&gt; CAF Resistance<br />
&gt; UV Blocking</p>
<p>Application<br />
Computer, Communication Equipment, Instrumentation, TV, VCR, Electronic Game Machine, LCD, Automotive, etc.</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit IS680</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/is680/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:15:19 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/is680/</guid>

					<description><![CDATA[S680 AG is suitable for many of today’s commercial RF/ microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, IS680AG offers an ultra-low dissipation factor (Df), making it an extremely cost-effective alternative to PTFE and other commercial microwave laminate materials in [...]]]></description>
										<content:encoded><![CDATA[<p><span dir="ltr" role="presentation">S680 AG is suitable for many of today’s commercial RF/ microwave printed circuit </span><br role="presentation"><span dir="ltr" role="presentation">designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C </span><br role="presentation"><span dir="ltr" role="presentation">up to W-band frequencies. In addition, IS680AG offers an ultra-low dissipation factor </span><br role="presentation"><span dir="ltr" role="presentation">(Df), making it an extremely cost-effective alternative to PTFE and other commercial </span><br role="presentation"><span dir="ltr" role="presentation">microwave laminate materials in double sided application</span></p>
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			</item>
		<item>
		<title>Printed circuit IT180</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/it180/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:14:40 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/it180/</guid>

					<description><![CDATA[High Tg / Lead Free / High Reliability Laminates &amp; Prepreg Excellent CAF resistance Good through-hole reliability Lead free, Hi-Tg and thermal reliability For automotive, Telecomunications, high layer PCB and heavy copper applications]]></description>
										<content:encoded><![CDATA[<p>High Tg / Lead Free / High Reliability Laminates &amp; Prepreg</p>
<ul>
<li>Excellent CAF resistance</li>
<li>Good through-hole reliability</li>
<li>Lead free, Hi-Tg and thermal reliability</li>
<li>For automotive, Telecomunications, high layer PCB and heavy copper applications</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit IT180A</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/it180a/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:14:00 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/it180a/</guid>

					<description><![CDATA[Low CTE / High Reability Laminate &amp; Prepreg Excellent CAF resistance Good through-hole reliability Lead free, Hi-Tg and thermal reliability For automotive, high layer PCB and heavy copper applications]]></description>
										<content:encoded><![CDATA[<p>Low CTE / High Reability Laminate &amp; Prepreg</p>
<ul>
<li>Excellent CAF resistance</li>
<li>Good through-hole reliability</li>
<li>Lead free, Hi-Tg and thermal reliability</li>
<li>For automotive, high layer PCB and heavy copper applications</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit KB 6160</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6160/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:13:18 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/kb-6160/</guid>

					<description><![CDATA[KB-6160 （ANSI：FR-4）Fiberglass laminate 130℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6160 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>130℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit KB 6160C</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6160c/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:12:39 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/kb-6160c/</guid>

					<description><![CDATA[KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6165 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>150℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit KB 6165</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6165/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:12:00 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/kb-6165/</guid>

					<description><![CDATA[KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6165 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>150℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit RO3035</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/ro3035/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:09:58 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/ro3035/</guid>

					<description><![CDATA[RO3035 high frequency laminates are part of the RO3000® series of materials. RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. Applications up to 30-40 GH Lower operating temperature and [...]]]></description>
										<content:encoded><![CDATA[<p>RO3035 high frequency laminates are part of the RO3000® series of materials.<br />
<span id="page936R_mcid67" class="markedContent"></span></p>
<p><span id="page936R_mcid67" class="markedContent"><span dir="ltr" role="presentation">RO3000</span></span><span id="page936R_mcid68" class="markedContent"><span dir="ltr" role="presentation">®</span></span><span id="page936R_mcid69" class="markedContent"><span dir="ltr" role="presentation"> high frequency circuit materials are ceramic-filled PTFE composites intended </span></span><span id="page936R_mcid70" class="markedContent"><br role="presentation"><span dir="ltr" role="presentation">for use in commercial microwave and RF applications. This family of products was </span></span><span id="page936R_mcid71" class="markedContent"><br role="presentation"><span dir="ltr" role="presentation">designed to offer exceptional electrical and mechanical stability at competitive prices. </span></span></p>
<p>Applications up to 30-40 GH<br />
Lower operating temperature and increased reliability in power amplifiers.</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit S1000</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/s1000/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:09:41 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/s1000/</guid>

					<description><![CDATA[Lead-free compatible FR-4 Laminate. UV Blocking AOI compatible. Excellent thermal reliability. Z-CTE 30-35% less than conventional FR-4. Excellent T/H reliability. Excellent anti-CAF and Q1000 performance. Low water absorption. Application: Computer, lnstrumentation, VCR, communication equipment, automotive electronics, electronic game machine, and etc.  ]]></description>
										<content:encoded><![CDATA[<p>Lead-free compatible FR-4 Laminate.<br />
UV Blocking<br />
AOI compatible.<br />
Excellent thermal reliability.<br />
Z-CTE 30-35% less than conventional FR-4.<br />
Excellent T/H reliability.<br />
Excellent anti-CAF and Q1000 performance.<br />
Low water absorption.</p>
<p>Application:<br />
Computer, lnstrumentation, VCR,<br />
communication equipment,<br />
automotive electronics,<br />
electronic game machine, and etc.</p>
<p>&nbsp;</p>
]]></content:encoded>
					
		
		
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		<item>
		<title>Printed circuit TLX9</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/tlx9/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:08:52 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/tlx9/</guid>

					<description><![CDATA[TLX PTFE fiberglass laminates are ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components. Resistance to creep for PWBs bolted to a housing thatencounters high levels of vibration during space launch High temperature exposure in engine modules Radiation resistance in space (see NASA’s website for lowoutgassing materials) [...]]]></description>
										<content:encoded><![CDATA[<p><span id="page1395R_mcid23" class="markedContent"><span dir="ltr" role="presentation"><span id="page1395R_mcid59" class="markedContent">TLX PTFE fiberglass laminates are ideal for use in radar systems,<br />
</span></span></span><span id="page1395R_mcid23" class="markedContent"><span dir="ltr" role="presentation"><span id="page1395R_mcid59" class="markedContent">mobile communications, microwave test equipment,<br />
microwave transmission devices and RF components.<br />
<br role="presentation"></span><span id="page1395R_mcid61" class="markedContent"></span></span></span></p>
<ul>
<li>Resistance to creep for PWBs bolted to a housing thatencounters high levels of vibration during space launch</li>
<li>High temperature exposure in engine modules</li>
<li>Radiation resistance in space (see NASA’s website for lowoutgassing materials)</li>
<li>Resistance to extreme environments at sea for warshipantennas</li>
<li>Resistance to a wide temperature range for altimetersubstrates during flight.</li>
</ul>
]]></content:encoded>
					
		
		
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