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	<title>Robotics &#8211; HIGH TECH</title>
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	<link>https://www.hightechelettronica.com/en/</link>
	<description>Elettronica PCB board e circuiti stampati Torino</description>
	<lastBuildDate>Tue, 29 Mar 2022 08:53:55 +0000</lastBuildDate>
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		<title>Printed circuit VT-481</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/vt-481/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:19:13 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/vt-481/</guid>

					<description><![CDATA[Mid-Tg FR4 &gt; Phenolic Cure System &amp; Lead Free Compatible &gt; Excellent Thermal Reliability &gt; Low Z-CTE &gt; CAF Resistance &gt; UV Blocking Application Computer, Communication Equipment, Instrumentation, TV, VCR, Electronic Game Machine, LCD, Automotive, etc.]]></description>
										<content:encoded><![CDATA[<p>Mid-Tg FR4<br />
&gt; Phenolic Cure System &amp; Lead Free Compatible<br />
&gt; Excellent Thermal Reliability<br />
&gt; Low Z-CTE<br />
&gt; CAF Resistance<br />
&gt; UV Blocking</p>
<p>Application<br />
Computer, Communication Equipment, Instrumentation, TV, VCR, Electronic Game Machine, LCD, Automotive, etc.</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit IS680</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/is680/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:15:19 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/is680/</guid>

					<description><![CDATA[S680 AG is suitable for many of today’s commercial RF/ microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, IS680AG offers an ultra-low dissipation factor (Df), making it an extremely cost-effective alternative to PTFE and other commercial microwave laminate materials in [...]]]></description>
										<content:encoded><![CDATA[<p><span dir="ltr" role="presentation">S680 AG is suitable for many of today’s commercial RF/ microwave printed circuit </span><br role="presentation"><span dir="ltr" role="presentation">designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C </span><br role="presentation"><span dir="ltr" role="presentation">up to W-band frequencies. In addition, IS680AG offers an ultra-low dissipation factor </span><br role="presentation"><span dir="ltr" role="presentation">(Df), making it an extremely cost-effective alternative to PTFE and other commercial </span><br role="presentation"><span dir="ltr" role="presentation">microwave laminate materials in double sided application</span></p>
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			</item>
		<item>
		<title>Printed circuit KB 6160</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6160/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:13:18 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/kb-6160/</guid>

					<description><![CDATA[KB-6160 （ANSI：FR-4）Fiberglass laminate 130℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6160 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>130℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit KB 6160C</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6160c/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:12:39 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/kb-6160c/</guid>

					<description><![CDATA[KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6165 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>150℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit KB 6165</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/kb-6165/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:12:00 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/kb-6165/</guid>

					<description><![CDATA[KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no filler ANTI-CAF]]></description>
										<content:encoded><![CDATA[<p>KB-6165 （ANSI：FR-4）Fiberglass laminate</p>
<ul>
<li>150℃ (By DSC), low Z-axis expansion</li>
<li>High Temperature of Decomposition (Td)</li>
<li>Excellent heat resistance and appropriate for Lead Free Assembly.</li>
<li>IPC-4101B/124 specification is applicable</li>
<li>Dicy –free and no filler</li>
<li>ANTI-CAF</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit RO3035</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/ro3035/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:09:58 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/ro3035/</guid>

					<description><![CDATA[RO3035 high frequency laminates are part of the RO3000® series of materials. RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. Applications up to 30-40 GH Lower operating temperature and [...]]]></description>
										<content:encoded><![CDATA[<p>RO3035 high frequency laminates are part of the RO3000® series of materials.<br />
<span id="page936R_mcid67" class="markedContent"></span></p>
<p><span id="page936R_mcid67" class="markedContent"><span dir="ltr" role="presentation">RO3000</span></span><span id="page936R_mcid68" class="markedContent"><span dir="ltr" role="presentation">®</span></span><span id="page936R_mcid69" class="markedContent"><span dir="ltr" role="presentation"> high frequency circuit materials are ceramic-filled PTFE composites intended </span></span><span id="page936R_mcid70" class="markedContent"><br role="presentation"><span dir="ltr" role="presentation">for use in commercial microwave and RF applications. This family of products was </span></span><span id="page936R_mcid71" class="markedContent"><br role="presentation"><span dir="ltr" role="presentation">designed to offer exceptional electrical and mechanical stability at competitive prices. </span></span></p>
<p>Applications up to 30-40 GH<br />
Lower operating temperature and increased reliability in power amplifiers.</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit S1000</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/s1000/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:09:41 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/s1000/</guid>

					<description><![CDATA[Lead-free compatible FR-4 Laminate. UV Blocking AOI compatible. Excellent thermal reliability. Z-CTE 30-35% less than conventional FR-4. Excellent T/H reliability. Excellent anti-CAF and Q1000 performance. Low water absorption. Application: Computer, lnstrumentation, VCR, communication equipment, automotive electronics, electronic game machine, and etc.  ]]></description>
										<content:encoded><![CDATA[<p>Lead-free compatible FR-4 Laminate.<br />
UV Blocking<br />
AOI compatible.<br />
Excellent thermal reliability.<br />
Z-CTE 30-35% less than conventional FR-4.<br />
Excellent T/H reliability.<br />
Excellent anti-CAF and Q1000 performance.<br />
Low water absorption.</p>
<p>Application:<br />
Computer, lnstrumentation, VCR,<br />
communication equipment,<br />
automotive electronics,<br />
electronic game machine, and etc.</p>
<p>&nbsp;</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit VT-42</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/vt-42/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:07:20 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/vt-42/</guid>

					<description><![CDATA[Dicy Cured System Standard FR4.0 (Tg140˚C) UV Blocking Application Computer, Communication Equipment, Instrumentation, TV, VCR, Electronic Game Machine, LCD, Automotive, etc.]]></description>
										<content:encoded><![CDATA[<p>Dicy Cured System<br />
Standard FR4.0 (Tg140˚C)<br />
UV Blocking</p>
<p>Application<br />
Computer, Communication Equipment, Instrumentation, TV, VCR, Electronic Game Machine, LCD, Automotive, etc.</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit IS410</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/is410/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:04:42 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/is410/</guid>

					<description><![CDATA[IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder. Superior performance through multiple thermal excursions – passes 6x @ 288°C Optimized for drilling small holes (≤10 mils)]]></description>
										<content:encoded><![CDATA[<p>IS410 is a high-performance FR-4 epoxy laminate and prepreg system<br />
designed to support the printed circuit board industry’s requirements<br />
for higher levels of reliability and the trend to use lead‑free solder.</p>
<ul>
<li>Superior performance through multiple thermal excursions – passes 6x @ 288°C</li>
<li>Optimized for drilling small holes (≤10 mils)</li>
</ul>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Printed circuit IS400</title>
		<link>https://www.hightechelettronica.com/en/circuito-stampato/is400/</link>
		
		<dc:creator><![CDATA[emotion@hightech]]></dc:creator>
		<pubDate>Tue, 23 Nov 2021 16:04:01 +0000</pubDate>
				<guid isPermaLink="false">https://www.hightechelettronica.com/circuito-stampato/is400/</guid>

					<description><![CDATA[It is intended for multilayer Printed Wiring Board (PWB) applications where demanding thermal performance and high reliability are required. IS400 laminate and prepreg products are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 330°C decomposition temperature and a low Z-axis expansion. RoHS Compliant CAF resistant FR-4 process [...]]]></description>
										<content:encoded><![CDATA[<p>It is intended for multilayer Printed Wiring Board (PWB) applications where demanding<br />
thermal performance and high reliability are required. IS400 laminate and prepreg<br />
products are manufactured using Isola’s patented technology, reinforced with<br />
electrical grade (E-glass) glass fabric. This system delivers a 330°C decomposition<br />
temperature and a low Z-axis expansion.</p>
<p>RoHS Compliant<br />
CAF resistant<br />
FR-4 process compatible<br />
Heavier copper available</p>
]]></content:encoded>
					
		
		
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