{"id":4506,"date":"2021-11-23T17:12:00","date_gmt":"2021-11-23T16:12:00","guid":{"rendered":"https:\/\/www.hightechelettronica.com\/circuito-stampato\/kb-6165\/"},"modified":"2022-03-29T10:51:41","modified_gmt":"2022-03-29T08:51:41","slug":"kb-6165","status":"publish","type":"circuito-stampato","link":"https:\/\/www.hightechelettronica.com\/en\/circuito-stampato\/kb-6165\/","title":{"rendered":"Printed circuit KB 6165"},"content":{"rendered":"<p>KB-6165 \uff08ANSI\uff1aFR-4\uff09Fiberglass laminate<\/p>\n<ul>\n<li>150\u2103 (By DSC), low Z-axis expansion<\/li>\n<li>High Temperature of Decomposition (Td)<\/li>\n<li>Excellent heat resistance and appropriate for Lead Free Assembly.<\/li>\n<li>IPC-4101B\/124 specification is applicable<\/li>\n<li>Dicy \u2013free and no filler<\/li>\n<li>ANTI-CAF<\/li>\n<\/ul>\n","protected":false},"featured_media":4589,"parent":0,"template":"","meta":{"ngg_post_thumbnail":0},"produttore":[167],"settore":[119,126],"_links":{"self":[{"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/circuito-stampato\/4506"}],"collection":[{"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/circuito-stampato"}],"about":[{"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/types\/circuito-stampato"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/media\/4589"}],"wp:attachment":[{"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/media?parent=4506"}],"wp:term":[{"taxonomy":"produttore","embeddable":true,"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/produttore?post=4506"},{"taxonomy":"settore","embeddable":true,"href":"https:\/\/www.hightechelettronica.com\/en\/wp-json\/wp\/v2\/settore?post=4506"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}