Caratteristiche materiale:
DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminate
featuring an adhesive-less, all-polyimide dielectric laye
featuring an adhesive-less, all-polyimide dielectric laye
Low loss all-polyimide dielectric for superior signal integrity
• Excellent bond strength affords high reliability
• High thermal resistance to facilitate processing
• Balanced and unbalanced constructions available
• Certified to IPC 4204/11
• UL 94 V-0, UL File E124294
• RoHS Compliant
Settori di appartenenza:
- Tg : 220°
- Dk(1 MHz) : 3.4 – (10 GHz) : 3.2
- Df(1 MHz) : 0.002 – (10 GHz) : 0.003
📑 SCHEDA TECNICA
