Caratteristiche materiale:
High Tg / Lead Free / High Reliability Laminates & Prepreg
- Excellent CAF resistance
- Good through-hole reliability
- Lead free, Hi-Tg and thermal reliability
- For automotive, Telecomunications, high layer PCB and heavy copper applications
Settori di appartenenza:
- Tg : 175°
- Dk(1 GHz) : 4.2
- Df(1 GHz) : 0.017
📑 SCHEDA TECNICA












