Caratteristiche materiale: KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no...
Caratteristiche materiale: KB-6165 （ANSI：FR-4）Fiberglass laminate 150℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no...
Caratteristiche materiale: KB-6160 （ANSI：FR-4）Fiberglass laminate 130℃ (By DSC), low Z-axis expansion High Temperature of Decomposition (Td) Excellent heat resistance and appropriate for Lead Free Assembly. IPC-4101B/124 specification is applicable Dicy –free and no...
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