da admin | Mag 26, 2026 | KB
Caratteristiche materiale:
KB-6165 （ANSI：FR-4）Fiberglass laminate
- 150℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Settori di appartenenza:
- Tg : 153°
- Dk(1 MHz) : 4.65
- Df(1 MHz) : 0.018
da admin | Mag 26, 2026 | KB
Caratteristiche materiale:
KB-6165 （ANSI：FR-4）Fiberglass laminate
- 150℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Settori di appartenenza:
- Tg : 135°
- Dk(1 MHz) : 4.58
- Df(1 MHz) : 0.022
da admin | Mag 26, 2026 | KB
Caratteristiche materiale:
KB-6160 （ANSI：FR-4）Fiberglass laminate
- 130℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Settori di appartenenza:
- Tg : 130°
- Dk(1 MHz) : 4.58
- Df(1 MHz) : 0.022
da admin | Mag 26, 2026 | Iteq
Caratteristiche materiale:
Low CTE / High Reability Laminate & Prepreg
- Excellent CAF resistance
- Good through-hole reliability
- Lead free, Hi-Tg and thermal reliability
- For automotive, high layer PCB and heavy copper applications
Settori di appartenenza:
- Tg : 180°
- Dk(1 GHz) : 4.3
- Df : 0.022 (2.5 ghZ)
da admin | Mag 26, 2026 | Iteq
Caratteristiche materiale:
High Tg / Lead Free / High Reliability Laminates & Prepreg
- Excellent CAF resistance
- Good through-hole reliability
- Lead free, Hi-Tg and thermal reliability
- For automotive, Telecomunications, high layer PCB and heavy copper applications
Settori di appartenenza:
- Tg : 175°
- Dk(1 GHz) : 4.2
- Df(1 GHz) : 0.017
