da admin | Mag 26, 2026 | Dupont
Caratteristiche materiale:
DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminate
featuring an adhesive-less, all-polyimide dielectric laye
Low loss all-polyimide dielectric for superior signal integrity
• Excellent bond strength affords high reliability
• High thermal resistance to facilitate processing
• Balanced and unbalanced constructions available
• Certified to IPC 4204/11
• UL 94 V-0, UL File E124294
• RoHS Compliant
Settori di appartenenza:
- Tg : 220°
- Dk(1 MHz) : 3.4 – (10 GHz) : 3.2
- Df(1 MHz) : 0.002 – (10 GHz) : 0.003
da admin | Mag 26, 2026 | Dupont
Caratteristiche materiale:
DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminatefeaturing an adhesive-less, all-polyimide dielectric laye
Low loss all-polyimide dielectric for superior signal integrity
• Excellent bond strength affords high reliability
• High thermal resistance to facilitate processing
• Balanced and unbalanced constructions available
• Certified to IPC 4204/11
• UL 94 V-0, UL File E124294
• RoHS Compliant
Settori di appartenenza:
- Tg : 220°
- Dk(1 MHz) : 3.4 – (10 GHz) : 3.2
- Df(1 MHz) : 0.002 – (10 GHz) : 0.003
da admin | Mag 26, 2026 | Isola
Caratteristiche materiale:
370HR is a high performance 180°C glass transition temperature
(Tg) FR-4 system for multilayer Printed Wiring Board (PWB)
applications where maximum thermal performance and reliability
are required.High Thermal Performance
- Tg: 180°C (DSC)
- Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
- T260: 60 minutes
- T288: 30 minutes
RoHS Compliant
UV Blocking and AOI Fluorescence
Settori di appartenenza:
- Tg : 180°
- Dk(1 GHz) : 4.04
- Df : 0.021 (2.5 ghZ)
da admin | Mag 18, 2026 | Bergquist
Caratteristiche materiale:
Applications
• High watt-density applications where achieving low thermal resistance is required
• Power conversion
• Heat-rails
• Solid state relays
• Motor drives
• LED applications
Settori di appartenenza:
- Tg : 90
- BreakdownVoltage : 8.5KVac
- Thermal Conductivity : 2.4W/m-K
- Dk(1 MHz) : 6
