da admin | Mag 26, 2026 | Shengyi Technology
Caratteristiche materiale:
Lead-free compatible FR-4 Laminate.
UV Blocking
AOI compatible.
Excellent thermal reliability.
Lower Z-Axis CTE.
Excellent T/H reliability.
Excellent anti-CAF performance.
Low water absorption.
Suitable for high aspect ratio and high-layer PCB.
Widely used in computer, communication equipment,
precise apparatus and instrument, router, and etc.
Settori di appartenenza:
- Tg : 170°
- Dk(1 MHz) : 5.4
- Df(1 MhZ) : 0.035
da admin | Mag 26, 2026 | Shengyi Technology
Caratteristiche materiale:
Lead-free compatible FR-4 Laminate.
UV Blocking
AOI compatible.
Excellent thermal reliability.
Z-CTE 30-35% less than conventional FR-4.
Excellent T/H reliability.
Excellent anti-CAF and Q1000 performance.
Low water absorption.
Application:
Computer, lnstrumentation, VCR,
communication equipment,
automotive electronics,
electronic game machine, and etc.
Settori di appartenenza:
- Tg : 155°
- Dk(1 MHz) : 4.9
- Df(1 MhZ) : 0.011
da admin | Mag 26, 2026 | Rogers Corporation
Caratteristiche materiale:
RO3035 high frequency laminates are part of the RO3000® series of materials.
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended
for use in commercial microwave and RF applications. This family of products was
designed to offer exceptional electrical and mechanical stability at competitive prices.
Applications up to 30-40 GH
Lower operating temperature and increased reliability in power amplifiers.
Settori di appartenenza:
- Ceramic-filled PTFE base
- Dk(10 GHz) : 3.5
- Df(10 ghZ) : 0.015
da admin | Mag 26, 2026 | KB
Caratteristiche materiale:
KB-6165 (ANSI:FR-4)Fiberglass laminate
- 150℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Settori di appartenenza:
- Tg : 153°
- Dk(1 MHz) : 4.65
- Df(1 MHz) : 0.018
da admin | Mag 26, 2026 | KB
Caratteristiche materiale:
KB-6165 (ANSI:FR-4)Fiberglass laminate
- 150℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Settori di appartenenza:
- Tg : 135°
- Dk(1 MHz) : 4.58
- Df(1 MHz) : 0.022